We know that Russia faced sanctions in many areas due to its war with Ukraine. Russia, which wants to cut its own core, is making plans to revive semiconductor production because it cannot buy chips from suppliers. There are large investments in the country’s eight-year plan.
Until a few days ago, we wrote that TSMC will reach “2nm” technology by 2026. Russia, on the other hand, wants to produce 28nm chips with its own capabilities by 2030. In fact, this target may seem rather weak when looked at globally, but it is a very important step for the country to be self-sufficient.
The Russian government has taken the first steps for a new microelectronics development plan that will require an investment of approximately $38 billion by 2030. The allocated budget will be spent on local semiconductor manufacturing technologies, local chip development, data center infrastructure and computer development.
Based on the semiconductor part, the country plans to spend 5 billion dollars for new production technologies. One of the short-term goals is to accelerate local chip production using 90nm manufacturing technology by the end of the year. A longer-term goal is to develop chips with 28nm technology by 2030, as TSMC did in 2011.