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5-G chipset called Dimensity 9000 was announced by Taiwanese chip manufacturer MediaTek. Dimensity 9000 stands out as the world’s first 4 nm TSMC chipset, which should improve performance while increasing power efficiency. The new 5G chipset also made history as the world’s first smartphone chipset that uses the Cortex-X2 core clocked up to 3.05 GHz and includes Bluetooth 5.3.

What are the Dimensity 9000 Features?

Dimensity 9000 is arranged in a 1+3+4 setup. In addition to a single Cortex-X2 ultra-core, this setup includes 3 super-core Cortex-A710 clusters clocked at up to 2.85 GHz and 4 efficient Cortex-A510 core clusters clocked at 1.8 GHz. The chipset will support LPDDR5x RAM speeds of up to 7500 Mbps on smartphones. Additionally, the chipset has 14MB of cache, which increases performance by 7 percent and bandwidth consumption by 25 percent compared to just 8MB of cache.

For graphics, it’s given a new 10-core Mali-G710 GPU. There’s even a new ray tracing SDK available for developers to bring new visual improvements to approach PC-level graphics performance.

There are some updated connections with Bluetooth 5.3 for the first time in smartphone chips. Also, Wi-Fi 6E 2×2 is supported. The chipset is Bluetooth Audio LE ready with Dual Link True Wireless Stereo Audio and supports a new Beidou III-B1C GNSS standard.

Dimensity 9000’s ISP (Image Signal Processor) is capable of capturing 4K HDR video from three cameras simultaneously, in theory. MediaTek states that it can process a total of 270 frames per second to output 18-bit 4K HDR video by capturing three exposures simultaneously from three cameras, each passing through one of the three ISPs. The ISP also supports camera sensors up to 320 MP.

The 5G modem complies with the 3GPP Release-16 standard. Although still no mmWave this time, this modem supports 6 GHz 5G with 3CC Carrier Aggregation (300 MHz) theoretical maximum download speeds of 7 Gbps. This is also the only 5G smartphone modem that supports R16 UL Tx switching for both SUL and NR UL-CA based connections. The modem can also provide improved power consumption for both active and standby 5G connections.

The new APU (AI Processing Unit) is the performance leader in ETHZ, an AI benchmark test, while supporting up to 4x better performance than the previous generation. MediaTek claims that Dimensity 9000 outperforms Google Tensor by 16 percent in artificial intelligence performance.

The first smartphones using the Dimensity 9000 chipset are scheduled to be released in the late first quarter.


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Michael Lewis

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