AMD has registered with the US Patent and Trademark Office the name 3D V-Cache, the company’s stackable cache technology. Developed in partnership with TSMC, the technology was announced alongside EPYC Milan-X processors, which so far only offer up to 768 MB of memory. However, AMD’s trademark indicates that the technology can be adapted to other AMD products such as GPUs.
There are 23 instances of “GPU” in the documentation, while the name “CPU” only occurs 12 times. Besides CPUs and GPUs, AMD’s trademark actually encompasses a wide variety of technological applications: SoCs, solid-state drives, DRAM, DRAM controllers, and memory cards.
In fact, we mentioned a few weeks ago that the red team could move the 3D cache technology to the Radeon display cards. While AMD attaches great importance to Infinity Cache memory in the RDNA 2 architecture, this solution makes significant contributions to efficiency and performance. Indeed, it is only natural that the company wants to expand its 3D V-Cache applications to the GPU world.
A silicon powered by 3D V-Cache technology has yet to go to retail, but this solution was announced with big vaadollarser. Designed to add an additional layer of cache to chips, 3D V-Cache can be used to attach an SRAM cache to a specific chip, leveraging advanced packedollarseme technologies.
The company’s goal is to increase the amount of cache used for the GPU and CPU and keep as much information as possible close to the processing units, reducing both power consumption and latency. AMD expects the first 3D V-Cache processors to deliver performance gains of up to 15% for certain gaming workloads.